Progress and developments in the field of materials for transient liquid phase bonding and active soldering processes

Lugscheider, Erich; Ferrara, S.; Janssen, H.; Reimann, A.; Wildpanner, B.

Berlin [u.a.] : Springer (2004)
Contribution to a conference proceedings, Journal Article

In: Microsystem technologies
Volume: 10
Issue: 3
Page(s)/Article-Nr.: 233-236


  • Chair of Surface Engineering [419010]