Progress and developments in the field of materials for transient liquid phase bonding and active soldering processes
Lugscheider, Erich; Ferrara, S.; Janssen, H.; Reimann, A.; Wildpanner, B.
Berlin [u.a.] : Springer (2004)
Contribution to a conference proceedings, Journal Article
In: Microsystem technologies
Volume: 10
Issue: 3
Page(s)/Article-Nr.: 233-236
Institutions
- Chair of Surface Engineering [419010]
Identifier
- DOI: 10.1007/s00542-003-0351-6
- RWTH PUBLICATIONS: RWTH-CONV-063659