Solder deposition for transient liquid phase (TLP)-bonding by MSIP-PVD-process

Lugscheider, Erich; Bobzin, Kirsten; Erdle, Anja

Amsterdam [u.a.] : Elsevier (2003)
Contribution to a conference proceedings, Journal Article

In: Surface & coatings technology
Volume: 174/175.2003
Page(s)/Article-Nr.: 704-707

Institutions

• Chair of Surface Engineering [419010]