HS-PVD
The HS-PVD (high speed-physical vapour deposition) technology belongs to the family of sputter technologies and works on the principle of gas flow sputtering. It is based on the hollow cathode principle and has a directed particle stream, which allows the coating deposition on surfaces outside the line of sight. The potential of this process can be found particularly in the high deposition rates, which can reach up to ds/dt = 100 µm/h depending on the desired coating material. The components can be coated while rotating, as well as in stationary mode. The coating temperature can reach up to T = 1,100 °C through a heater above the component.
Technical data
Parameter | Value |
---|---|
Max. temperature of the base material |
T = 1,100 °C |
Coating materials | carbide, nitride, oxide |
Coating rate |
max. ds/dt = 100 µm/h |
Electrical power output | P = 20 kW |
Forms of voltage |
direct current (dc), unipolar pulsed, |
Max. bias-power | Pbias = 10 kW |
Max. bias-voltage |
Ubias = 1,000 V |
Frequency |
f = 0 – 50 kHz |
Hollow cathode with of two parallel target blocks |